Semicon R&D Thermal Compression Engineer
1 open position
Purpose of the Job:
• To lead the development, evaluation, and optimization of advanced Thermal Compression (TC) bonding and chip attach processes and equipment for next-generation advanced packaging technologies (e.g., chiplet integration, HBM, 2.5D/3D architectures).
• To establish robust bonding recipes, ensure precise co-planarity and alignment control, and successfully drive TC bonder tools from R&D concept validation to customer/internal qualification.
Job :
• Advanced TC Bonding Process development for CoWoS PKG product family and CPO
• Tool & Hardware Development / Qualification
• Warpage & Co-planarity Control
• Failure Analysis & Reliability Enhancement
• Customer Development & Technology Transfer
• Lead assigned projects
• Yield Improvement & Yield Failure Analysis (FA)
Requirement:
• Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
• R&D or mass production experience of at least three years in Thermal Compression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes
• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements
• Fundamental understanding of advanced semiconductor packaging processes, thermal-mechanical bonding behavior, and warpage control
• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
• Ability to prepare technical documents and deliver presentations to internal and external stakeholders
• Proficiency in reading and writing technical documents
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:JOB-00951
Semicon R&D Plating/Wet Etch Engineer
1 open position
Purpose of the Job:
• To research, develop, and qualify next-generation electroplating technologies (including fine-pitch RDL, Cu pillar, and micro-bump) to meet the requirements of advanced packaging technical roadmaps.
• To establish robust plating process windows, evaluate new chemistry and equipment, and drive technical solutions from early-stage R&D concepts to pilot-line qualification.
Job :
• Plating/Wet Process development for Adv. PKG product
• New Material, Chemistry & Equipment Development and Qualification
• Lead assigned Customer Development program
• Defect Analysis & Failure Analysis (FA)
• Technology Transfer & Documentation
Requirement:
• Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
• R&D or mass production experience in at least three years of the following processes; plating, etching, stripping
• Fundamental understanding of advanced semiconductor fabrication processes
• Strong skills in experimental design, data analysis and technical reporting
• Ability to prepare technical documents and deliver presentations
• Proficiency in reading and writing technical documents
• Basic knowledge of equipment and materials used in semiconductor process
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:JOB-00950
Semicon R&D Lithography Engineer
1 open position
Purpose of the Job:
• To design, qualify, and optimize advanced lithography processes that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
Job :
• Lead assigned projects.
• Equipment & Material Evaluation
• Photolithography Process Development & Optimization
• Technology Qualification & Transfer
• Yield Improvement & Yield Failure Analysis (FA)
Requirement:
• Bachelor’s degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials
• Minimum 3 years hand-on experience in process development for photolithography
• In-depth knowledge and on hand experience of lithographic techniques, photoresist chemistry, and exposure systems
• Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel)
• Strong analytical and problem-solving skills
• Excellent communication and teamwork abilities
• Strong ability to drive actions and solutions through cross-functional teams.
• Experience in customer-driven development programs, customer qualification, and technical issue resolution for semiconductor packaging solutions.
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:JOB-00949
Semicon R&D Engineer (Underfill)
1 open position
Purpose of the Job:
• To design, qualify, and optimize advanced underfill processes (e.g., CUF, MUF, NCF/NCP) that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
Job:
• Advanced Underfill Process development for CoWoS PKG product family and CPO
• Dispensing & Material Evaluation / Qualification
• Void & Fillet Control
• Failure Analysis & Reliability Enhancement
• Customer Development & Technology Transfer
• Lead assigned projects
• Yield Improvement & Yield Failure Analysis (FA)
Requirement:
• Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials, etc.)
• R&D or mass production experience of at least three years in Underfill processes (e.g., CUF, MUF, NCF/NCP), dispensing, or encapsulation technology
• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements
• Fundamental understanding of advanced semiconductor packaging processes, underfill fluid dynamics, void-free encapsulation, and thermal-mechanical stress control
• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
• Ability to prepare technical documents and deliver presentations to internal and external stakeholders
• Proficiency in reading and writing technical documents
• Basic knowledge of underfill equipment (dispenser, cure oven), epoxy/resin materials, and inspection/reliability characterization tools
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:JOB-00948