Wire Bond NPI & Process Development

• Lead wire bonding process development and optimization for new Customer products from NPI through mass production.
• Develop and optimize wire bonding recipes, bonding parameters, loop profiles, bond locations, and process windows.
• Conduct DOE, process characterization, capability studies, and process qualification.
• Support new product ramp-up, process transfer, and production readiness activities.
• Evaluate new wire, capillary, leadframe, substrate, and bonding technologies.
• Establish process specifications, control plans, work instructions, and engineering documentation.
• Drive process robustness and ensure successful NPI qualification within project timelines.

Production Line Sustaining

• Provide technical support for daily production line issues related to wire bonding processes and equipment.
• Analyze production yield, reject trends, process capability, and equipment performance to identify improvement opportunities.
• Support production line recovery following equipment breakdowns, process abnormalities, or maintenance activities.
• Monitor critical process and equipment parameters to ensure stable and consistent production performance.
• Implement corrective and preventive actions to reduce recurring production issues.

Equipment & Line Maintenance Support

• Work closely with Equipment Engineering to troubleshoot wire bonder equipment and process-related issues.
• Support preventive maintenance, machine setup, equipment qualification, and post-maintenance verification.
• Verify machine performance and process stability before releasing equipment back to production.
• Support equipment relocation, machine installation, qualification, and process transfer activities.
• Work with equipment suppliers to resolve machine performance, recipe portability, process, and technical issues.
• Establish standardized machine setup and process conditions across production lines.

Failure Analysis & Continuous Improvement

• Lead root cause investigations for internal and customer-related wire bonding failures.
• Utilize structured problem-solving methodologies such as 5-Why, Fishbone, DOE, and statistical analysis.
• Conduct failure analysis and correlate process, equipment, material, and product data to determine root causes.
• Drive continuous improvement projects to improve yield, productivity, UPH, process capability, and equipment utilization.
• Identify opportunities for automation, process optimization, cost reduction, and manufacturing efficiency improvement.
• Verify the effectiveness of corrective and preventive actions.

Quality & Customer Support

• Ensure wire bonding processes meet internal quality standards and customer requirements.
• Support SPC monitoring, OOC/OOS investigations, process capability analysis, and quality improvement activities.
• Support customer audits, engineering evaluations, and technical investigations when required.
• Prepare technical reports, qualification reports, and engineering presentations.
• Support implementation of engineering changes and process improvements.

Cross-Functional Collaboration

• Collaborate with Production, Equipment, Quality, Product Engineering, Materials, and NPI teams to resolve technical issues.
• Provide technical guidance and training to production technicians and operators.
• Communicate technical risks, project progress, and improvement activities to stakeholders and management.
• Work with external suppliers and equipment vendors on technical development and troubleshooting.

Requirements

• Bachelor’s degree in Mechanical, Electrical, Electronics, Manufacturing, Materials Engineering, or a related discipline.
• Experience in semiconductor assembly, wire bonding, or backend manufacturing is preferred.
• Hands-on experience with wire KNS bonding equipment
• Good understanding of wire bonding processes, equipment, materials, capillaries, leadframes
• Experience in NPI, process qualification, DOE, SPC, FMEA, and root cause analysis.
• Strong troubleshooting and analytical skills with a hands-on approach to production problems.
• Good understanding of semiconductor assembly manufacturing processes and quality requirements.
• Strong communication and interpersonal skills with the ability to work effectively in a cross-functional environment.
• Able to work independently, manage multiple projects, and meet NPI and production support timelines.

Preferred Skills

• Experience in Au, Cu, Ag, or Pd-coated wire bonding.
• Experience with fine-pitch or small-diameter wire bonding.
• Experience in wire bond process optimization and machine-to-machine process matching.
• Knowledge of bond pull/shear testing and wire bond reliability requirements.
• Experience with semiconductor package failure analysis.
• Familiarity with statistical analysis and data-driven process improvement.
• Experience working with equipment suppliers and supporting machine installation or qualification.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos : R1110618

Job ID:JOB-01108