Wirebond Equipment Associate Engineer
02 Oct 2026Job Description:
Job Summary
We are seeking a motivated and hands-on Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.
Key Responsibilities
· Perform machine setup, qualification, and conversion for wire bond equipment.
· Troubleshoot and repair equipment-related issues to minimize production downtime.
· Conduct preventive and corrective maintenance activities.
· Monitor equipment performance and implement improvement actions.
· Support production during machine breakdowns and urgent technical issues.
· Perform root cause analysis and corrective actions.
· Maintain equipment documentation and spare parts records.
Job Requirements
· Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related field.
· Minimum 2 years of hands-on experience in wire bond equipment maintenance and troubleshooting.
· Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.
· Strong troubleshooting and problem-solving skills.
· Knowledge of semiconductor backend assembly processes is an advantage.
Working Conditions
· Able to support 12-hour rotating shifts.
· Willing to work both Day Shift and Night Shift based on operational requirements.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos : R1110618
Job ID:JOB-01277