Semicon Process Engineer (Wafer Saw,Laser Groove ,Backgrind)
07 May 2026Job Description:
Job:
• To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.
• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.
• Ability to lead cross functional teams to drive improvement.
Requirement:
• Degree in Engineering with at least 3 years Process experience in fast moving semiconductor industry.
• Knowledge in JMP, SPC, 8D, MSA, FMEA and DOE methodologies will be advantageous.
• Experience in Taping, Inline Back grind, Laser Groove, Wafer Saw process is an advantage.
• Independent self starter to drive to meet operation goals.
• High level of commitment and passion.
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:JOB-00187