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Semicon Process Engineer (Wafer Saw,Laser Groove ,Backgrind)

07 May 2026
  • Singapore
  • On-site

Job Description:

 

Job:

 

•     To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.

•     Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.

•     Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

•     Ability to lead cross functional teams to drive improvement.

 

Requirement:

•     Degree in Engineering with at least 3 years Process experience in fast moving semiconductor industry.

•     Knowledge in JMP, SPC, 8D, MSA, FMEA and DOE methodologies will be advantageous.

•     Experience in Taping, Inline Back grind, Laser Groove, Wafer Saw process is an advantage.

•     Independent self starter to drive to meet operation goals.

•     High level of commitment and passion.

 

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

 

We regret that only shortlisted candidates will be notified

 

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:JOB-00187