Purpose of the Job:

•           To oversee, maintain, and optimize all core Chip-on-Wafer (CoW) line equipment and associated utility interfaces to ensure maximum tool availability, process stability, and high operational yield.

•           To lead routine/advanced preventive maintenance (PM), resolve critical equipment breakdowns, and drive tool qualification/hook-up for CoW line equipment, leveraging 10+ years of deep technical expertise in advanced 2.5D/3D packaging equipment.

Key Job Accountabilities:

•           Full-line CoW Equipment & Utility Maintenance Management (e.g., TCB, Flip Chip Bonder, CMP, Dicing, Cleansing)

•           Advanced Troubleshooting, Root-Cause Failure Analysis & Preventive Maintenance (PM) Optimization

•           New Tool Hook-up, Setup, Buy-off & High-Precision Calibration (Sub-micron Alignment)

•           Tool OEE(Overall Equipment Effectiveness) Optimization, Unplanned Downtime Reduction & Spare Parts Inventory Control

•           Collaboration with Process & R&D Engineers to Resolve Yield Issues and Ensure Line Stability

•           Equipment Vendor Technical Management, Tool Specification Review & Escalation Handling

Required Experience and Qualifications:

•           Bachelor’s degree in Mechanical Engineering, Electrical/Electronic Engineering, Material Science, or related engineering disciplines (or Diploma with equivalent extensive industry experience)

•           Minimum 8 to 10 years of hands-on equipment engineering experience in semiconductor packaging, specifically in CoW, 2.5D/3D stacking, or Advanced Flip-Chip lines

•           Deep technical expertise in high-precision bonding equipment (TCB, FCB), dicing, CMP, or thin-wafer handling systems

•           Proven track record in equipment setup, utility hook-up (vacuum, CDA, ultra-pure water, specialty gases), and tool qualification for mass production/R&D

•           Strong analytical and problem-solving skills for complex equipment failure modes (FA), thermal-mechanical behavior, and yield enhancement

•           Excellent vendor management capability to direct equipment suppliers for technical modifications, tool upgrades, and escalation resolution

•           Strong communication skills for technical reporting, cross-functional collaboration, and vendor negotiations

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:JOB-01084