Summary:

Lead the development and optimization of lithography processes for both Fan-In and Fan-Out eWLB (Embedded Wafer Level Ball Grid Array) packaging technologies.

Responsible for driving key engineering projects such as yield improvement, cost reduction, and process transfers across global manufacturing sites.

Responsibilities:

•           Own and optimize lithography processes for PI, PR, and other patterning layers in both FO and FI eWLB.

•           Manage photolithography tools (GHI/i-line stepper, coat/develop tracks, etc.), including recipe setup and troubleshooting.

•           Lead cross-functional projects focused on cost reduction, process robustness, and NPI transfer.

•           Lead process improvements to enhance yield, throughput, and cost efficiency.

•           Evaluate and implement new lithography materials (PSPI, PR) and tools.

•           Define and maintain process documentation (SOP, OCAP, FMEA, SPC) and training programs.

•           Collaborate with equipment vendors, materials suppliers, and internal engineering teams to evaluate and qualify new tools or materials.

•           Design and perform DOE, root cause analysis, and statistical data analysis (e.g., JMP, Camline, etc.).

•           Support daily fab operations with issue resolution and yield improvement initiatives.

•           Mentor junior engineers and provide technical direction to the litho team.

Requirement:

•           Bachelor’s or Master’s degree in Engineering 

•           5+ years hands-on experience in photolithography process, preferably in advanced packaging 

•           Strong knowledge of lithography tooling, including exposure systems and coater/developer tracks.

•           Skilled in project management, process transfer, and cost/yield improvement.

•           Familiar with SPC, FMEA, and problem-solving methodologies.

•           Excellent communication skills, with proven ability to engage with both internal stakeholders and external customers.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:JOB-00586