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Wirebond Equipment Associate Engineer

02 Oct 2026
  • Singapore
  • Permanent
  • On-site

Job Description:

Job Summary

We are seeking a motivated and hands-on Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

Key Responsibilities

·       Perform machine setup, qualification, and conversion for wire bond equipment.

·       Troubleshoot and repair equipment-related issues to minimize production downtime.

·       Conduct preventive and corrective maintenance activities.

·       Monitor equipment performance and implement improvement actions.

·       Support production during machine breakdowns and urgent technical issues.

·       Perform root cause analysis and corrective actions.

·       Maintain equipment documentation and spare parts records.

Job Requirements

·       Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related field.

·       Minimum 2 years of hands-on experience in wire bond equipment maintenance and troubleshooting.

·       Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.

·       Strong troubleshooting and problem-solving skills.

·       Knowledge of semiconductor backend assembly processes is an advantage.

Working Conditions

·       Able to support 12-hour rotating shifts.

·       Willing to work both Day Shift and Night Shift based on operational requirements.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

 

We regret that only shortlisted candidates will be notified

 

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos : R1110618

Job ID:JOB-01277