Summary:

•           To manage, operate, and maintain all core Bumping process equipment and associated utility interfaces to ensure maximum tool availability and operational stability.

•           To execute routine preventive maintenance (PM), drive rapid breakdown troubleshooting, and lead tool qualification/hook-up for Bumping line equipment, leveraging a comprehensive technical understanding of full-line bumping operations.

Job:

•           Bumping Line Equipment & Utility Operation

•           Preventive Maintenance (PM) & Unplanned Breakdown Troubleshooting

•           Tool Hook-up, Setup & New Equipment Qualification

•           Equipment OEE Optimization & Spare Parts Management

•           Bumping Process Tool Failure Analysis (FA) & Yield Support

•           Equipment & Facility Vendor Technical Support Management

Requirement:

•           Bachelor’s degree or higher in Mechanical Engineering, Electrical/Electronic Engineering, Chemical Engineering, Material Science, or related disciplines

•           R&D or mass production experience of at least eight years in semiconductor equipment engineering, specifically in Bumping, MEOL, or 2.5D/3D advanced packaging (CoW)

•           Proven experience in leading and managing engineering teams, allocating resources, and overseeing daily line/equipment operations

•           In-depth technical knowledge of semiconductor equipment setup, hook-up, preventive maintenance (PM), and utility infrastructure (e.g., gases, chemicals, DI water, vacuum)

•           Strong capability in vendor management, negotiating tool specifications, and driving vendor technical support for new equipment qualification

•           Excellent problem-solving skills in equipment failure analysis (FA), OEE improvement, and cross-functional collaboration with process and utility teams

•           Proficiency in technical documentation and reading/writing/presenting in English for senior management and customer interactions

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:JOB-01077