Purpose of the Job:

•           To lead the development, evaluation, and optimization of advanced Thermal Compression (TC) bonding and chip attach processes and equipment for next-generation advanced packaging technologies (e.g., chiplet integration, HBM, 2.5D/3D architectures).

•           To establish robust bonding recipes, ensure precise co-planarity and alignment control, and successfully drive TC bonder tools from R&D concept validation to customer/internal qualification.

Job :

•           Advanced TC Bonding Process development for CoWoS PKG product family and CPO

•           Tool & Hardware Development / Qualification

•           Warpage & Co-planarity Control

•           Failure Analysis & Reliability Enhancement

•           Customer Development & Technology Transfer

•           Lead assigned projects

•           Yield Improvement & Yield Failure Analysis (FA)

Requirement:

•           Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)

•           R&D or mass production experience of at least three years in Thermal Compression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes

•           Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements

•           Fundamental understanding of advanced semiconductor packaging processes, thermal-mechanical bonding behavior, and warpage control

•           Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting

•           Ability to prepare technical documents and deliver presentations to internal and external stakeholders

•           Proficiency in reading and writing technical documents 

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:JOB-00951