Purpose of the Job:

•           To research, develop, and qualify next-generation electroplating technologies (including fine-pitch RDL, Cu pillar, and micro-bump) to meet the requirements of advanced packaging technical roadmaps.

•           To establish robust plating process windows, evaluate new chemistry and equipment, and drive technical solutions from early-stage R&D concepts to pilot-line qualification.

Job :

•           Plating/Wet Process development for  Adv. PKG product

•           New Material, Chemistry & Equipment Development and Qualification

•           Lead assigned Customer Development program

•           Defect Analysis & Failure Analysis (FA)

•           Technology Transfer & Documentation

Requirement:

•           Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)

•           R&D or mass production experience in at least three years of the following processes; plating, etching, stripping

•           Fundamental understanding of advanced semiconductor fabrication processes

•           Strong skills in experimental design, data analysis and technical reporting

•           Ability to prepare technical documents and deliver presentations

•           Proficiency in reading and writing technical documents 

•           Basic knowledge of equipment and materials used in semiconductor process

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:JOB-00950